Hot Keywords:
PRODUCTS CENTER
- Aluminum electrolytic capacitor
- Bolt type Ox horn type Lead type Patch type Unpolarized capacitor Horizontal capacitor Fixed product Solid state capacitance Solid-liquid mixed capacitor Ultracapacitor
- TOSHIBA
-
- MOSFET
- Bipolar Transistor/IGBT/IEGT
- diode
- Optical semiconductor
- Universal Linear IC
- Universal Logic IC
- sensor
- Micro controller
- Customized SoC
- IC for Wireless
- Vehicle components
- Image Recognition Processor Visconti™
- Special Image Processing IC for Vehicle Display
- Vehicle Audio IC
- Power Amplifier IC
- Vehicle Microcontroller
- simulation ASSP
- Vehicle Motor Driver
- Power Supply for Vehicle System
- Vehicle Communication RF-IC
- Special IC for Vehicle Communication Service (ETC/DSRC)
- vehicle MOSFET
- vehicle IPD
- Storage Solution of Automotive Information and Entertainment System
- Vehicle Bridge Chip
- Small packaged on-board components
- Vehicle optocoupler/optical relay
- Dedicated IC
- High frequency device
- Packaging and Packaging
- Product naming rules
微机微控制器举例2
- 东芝微控制器
-
微控制器内核
M0：00 M3：03 M4：04 R4：04R A9：09 19A：19A，19A／H1 - 微控制器子类型
-
ROM类型
C：掩膜 F：闪存 -
ROM尺寸
H M R S W Y Z D E 10 15 20 KB 16 32 56 64 128 256 384 514 768 1024 1536 2048 - 微控制器版本
-
汽车质量等级
R：A级，－40°C~+85°C T：A级，－40°C~+125°C
I：B级，－40°C~+85°C S：B级，－40°C~+125°C -
封装
QG：塑料收缩四边形无引线封装（VQON）；干燥包装
XBG：塑料球栅阵列（BGA、FBGA、TFBGA、VFBGA）；干燥包装
UG、FG、DFG：塑料四边形扁平封装（QFP、LQFP、HQFP）；干燥包装
DMG：塑料小外形封装（SOP）；干燥包装
NG：塑料收缩双列直插式封装（SDIP）